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Academic Journal

作者 : Yoon, Dahlnym ; Krüppel, Jonas ; Mokros, Andreas ; Zimmermann, Johannes

Source : Forensische Psychiatrie, Psychologie, Kriminologie; Aug2018, Vol. 12 Issue 3, p217-228, 12p

 

Academic Journal

作者 : Sapora, A. ; Torabi, A. R. ; Etesam, S. ; Cornetti, P.

Source : Fatigue & Fracture of Engineering Materials & Structures; Jul2018, Vol. 41 Issue 7, p1627-1636, 10p

Subjects : TENSILE strength ; LOADS (Mechanics) ; STRENGTH of materials ; FRACTURE mechanics ; STRAINS & stresses (Mechanics)

 

Academic Journal

作者 : Sapora, A ; Firrao, D

Source : Fatigue & Fracture of Engineering Materials & Structures; Jun2017, Vol. 40 Issue 6, p949-958, 10p, 5 Charts, 8 Graphs

Subjects : FRACTURE mechanics ; FRACTURE toughness (Materials science) ; NOTCHED bar testing ; AUSTENITIC steel ; METAL quenching

 

Academic Journal

作者 : Vize CE; Purdue University, United States. ; Collison KL; Purdue University, United States. ; Miller JD; University of Georgia, United States. ; Lynam DR; Purdue University, United States. Electronic address: dlynam@purdue.edu.

Source : Clinical Psychology Review [Clin Psychol Rev] 2018 Sep 13. Date of Electronic Publication: 2018 Sep 13.

 

Conference

Source : 2015 IEEE International Conference on Data Mining Workshop (ICDMW) Data Mining Workshops (ICDMW), 2013 IEEE 13th International Conference on Data Mining Workshop (ICDMW), 2015 IEEE International Conference on. :1705-1709 Nov, 2015

Subjects : Computing and Processing ; Signal Processing and Analysis ; Frequency modulation ; Data models ; Mathematical model ; Performance evaluation ; Adaptation models ; Support vector machines ; Predictive models ; cross-device connections ; Predictive analytics ; FFM ; Factorization machines

 

Conference

Source : 2015 Fourth International Conference on Aerospace Science and Engineering (ICASE) Aerospace Science and Engineering (ICASE), 2015 Fourth International Conference on. :1-5 Sep, 2015

Subjects : Aerospace ; Communication, Networking and Broadcast Technologies ; Components, Circuits, Devices and Systems ; Computing and Processing ; Engineered Materials, Dielectrics and Plasmas ; Engineering Profession ; Fields, Waves and Electromagn...

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